800 nm process

Semiconductor manufacturing processes with a 800 nm MOSFET technology node
Semiconductor
device
fabrication
MOSFET scaling
(process nodes)
  • 020 μm – 1968
  • 010 μm – 1971
  • 006 μm – 1974
  • 003 μm – 1977
  •  1.5 μm – 1981
  • 001 μm – 1984
  • 800 nm – 1987
  • 600 nm – 1990
  • 350 nm – 1993
  • 250 nm – 1996
  • 180 nm – 1999
  • 130 nm – 2001
  • 090 nm – 2003
  • 065 nm – 2005
  • 045 nm – 2007
  • 032 nm – 2009
  • 028 nm – 2010
  • 022 nm – 2012
  • 014 nm – 2014
  • 010 nm – 2016
  • 007 nm – 2018
  • 005 nm – 2020
  • 003 nm – 2022
Future
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The 800 nm process (800 nanometer process) is a level of semiconductor process technology that was reached in the 1987–1990 timeframe, by companies, such as Intel, ATI Technologies, and IBM.[1]

The 800 nm process refers to the minimum size that could be reliably produced. The smallest transistors and other circuit elements on a chip made with this process were around 800 nanometers wide.

Products featuring 800 nm manufacturing process

  • 50-MHz i486DX CPU launched in 1991 was manufactured using this process.[2]
  • Both 25/50 and 33/66 MHz Intel486 DX2 CPU using this process.[3]
  • Early version of Intel486 SX2 using this process.[4]
  • microSPARC I launched in 1992
  • First Intel P5 Pentium CPUs at 60 MHz and 66 MHz launched in 1993

References

  1. ^ "ATI EGA Wonder 800+ Specs". TechPowerUp. Retrieved 2022-09-16.
  2. ^ Chen, Allan, "The 50-MHz Intel486 Microprocessor", Intel Corporation, Microcomputer Solutions, September/October 1991, page 2
  3. ^ Intel Corporation, "Coming Attractions: Clock-Doubling Technology", Microcomputer Solutions, January/February 1992, page 6
  4. ^ Intel Corporation, "Coming Attractions: Clock-Doubling Technology", Microcomputer Solutions, January/February 1992, page 6
Preceded by
1 µm
CMOS manufacturing processes Succeeded by
600 nm


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